




The Changfan CF-28F2E4 is a cutting-edge Embodied AI Edge Computing Box engineered to support the NVIDIA® Jetson™ AGX Orin series modules (64GB, 32GB, and Industrial Edition). Delivering up to 275 TOPS of AI performance, it effortlessly handles real-time analysis of 16-channel 1080P video and local inference of complex deep learning models. It is the ultimate hardware foundation for industrial automation, machine vision, and intelligent logistics.
Built for Embodied AI & Extreme Reliability
Designed for harsh industrial environments, the CF-28F2E4 features a rugged chassis and supports an extended operating temperature range of -25°C to +65°C (or -40°C to +65°C for the Industrial Orin module). With a wide DC 9V~36V power input and a comprehensive ESD protection design, it ensures continuous and stable operation in the most demanding electromagnetic conditions.
Rich Industrial Connectivity
Equipped with 4x Gigabit RJ45 Ethernet ports, 4x USB Type-A, and 2x USB Type-C, it provides massive bandwidth for multi-camera setups. For seamless integration with PLCs, servos, and sensors, it integrates 2x RS232, 2x RS485, 2x CAN bus, and 3x isolated UART. Additionally, the built-in 4x isolated GPI and 4x isolated GPO (3.3V/5V adjustable) guarantee signal integrity.
Applications:
Embodied AI & Humanoid Robotics
Autonomous Mobile Robots (AMR) & AGVs
Industrial Machine Vision & Defect Detection
Smart Logistics & Warehouse Automation
Intelligent Transportation Systems
🛠 Changfan Customization Services
As a professional edge AI hardware manufacturer, Changfan offers comprehensive customization to meet your specific project requirements:
Hardware & I/O Modifications: Tailor the interface configurations, add specific expansion modules, or adjust the thermal design (fanless/active cooling) to fit your exact deployment scenario.
Mechanical & Enclosure Design: Custom chassis dimensions, customized mounting brackets, and full OEM/ODM branding (Logo printing and custom colors).
Software & OS Pre-configuration: Pre-flash specific Ubuntu OS images, pre-install NVIDIA JetPack SDKs, Docker containers, or your proprietary AI algorithms.
Flexible Configurations: Choose between Jetson AGX Orin 64GB, 32GB, or the robust Industrial Edition based on your budget and performance needs.
Specifications Table
Module | Jetson AGX Orin 64GB | Jetson AGX Orin 32GB | Jetson AGX Orin Industrial |
|---|---|---|---|
AI Performance | 275 TOPS | 200 TOPS | 248 TOPS |
GPU | 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores | 1792-core NVIDIA Ampere architecture GPU with 56 Tensor Cores | 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores |
CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU | 8-core Arm® Cortex®-A78AE v8.2 64-bit CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU |
Memory | 64GB 256-bit LPDDR5 | 32GB 256-bit LPDDR5 | 64GB 256-bit LPDDR5 (+ECC) |
Storage | 64GB eMMC 5.1 | 64GB eMMC 5.1 | 64GB eMMC 5.1 |
Video Encode | 2x 4K60 (H.265), 4x 4K30 (H.265) | 1x 4K60 (H.265), 3x 4K30 (H.265) | 1x 4K60 (H.265), 3x 4K30 (H.265) |
Video Decode | 1x 8K30 (H.265), 3x 4K60 (H.265) | 1x 8K30 (H.265), 2x 4K60 (H.265) | 1x 8K30 (H.265), 3x 4K60 (H.265) |
Display Interface | 1x HDMI | 1x HDMI | 1x HDMI |
USB Connector | 2x USB Type-C, 4x USB Type-A | 2x USB Type-C, 4x USB Type-A | 2x USB Type-C, 4x USB Type-A |
Ethernet | 4x RJ45 | 4x RJ45 | 4x RJ45 |
Buttons | 1x Recovery, 1x Reset, 1x PWR | 1x Recovery, 1x Reset, 1x PWR | 1x Recovery, 1x Reset, 1x PWR |
Expansion Interface | 1x miniPCIe, 1x M.2 B key (3050), 1x Nano SIM | 1x miniPCIe, 1x M.2 B key (3050), 1x Nano SIM | 1x miniPCIe, 1x M.2 B key (3050), 1x Nano SIM |
I/O Interface | 2x AUDIO, 2x MIC, 4x Isolated GPIO, 2x CAN | 2x AUDIO, 2x MIC, 4x Isolated GPIO, 2x CAN | 2x AUDIO, 2x MIC, 4x Isolated GPIO, 2x CAN |
Serial Port | 2x RS232, 2x RS485, 3x Isolated UART 3.3V | 2x RS232, 2x RS485, 3x Isolated UART 3.3V | 2x RS232, 2x RS485, 3x Isolated UART 3.3V |
Operating Temperature | -25℃ ~ +65℃ | -25℃ ~ +65℃ | -40℃ ~ +65℃ |
Dimensions | 202mm x 195mm x 65.5mm | 202mm x 195mm x 65.5mm | 202mm x 195mm x 65.5mm |
Power Requirement | DC + 9V~+36V | DC + 9V~+36V | DC + 9V~+36V |
Weight | 2361g | 2361g | 2361g |
Q1: How capable is the CF-28F2E4 in handling high-concurrency video analysis and complex AI model inference at the edge?
A: Equipped with high-performance NVIDIA® Jetson™ AGX Orin core modules (64GB/32GB/Industrial Edition), the CF-28F2E4 delivers up to 275 TOPS of staggering AI performance. With a powerful Ampere architecture GPU and up to 64GB LPDDR5 memory (204.8GB/s bandwidth), the device can stably support real-time encoding/decoding and intelligent analysis of 16 channels of 1080P HD video. It efficiently runs complex deep learning models locally, perfectly meeting the demanding real-time inference requirements of warehousing, industrial automation inspection, and advanced robotics.
Q2: For Embodied AI and Autonomous Mobile Robots (AMRs), what key industrial interfaces does the CF-28F2E4 provide?
A: To meet the complex multi-sensor integration and control needs of robots, the CF-28F2E4 provides an extremely rich I/O configuration:
Networking: 4x Gigabit RJ45 ports for complex network topologies; built-in SIM slot for 4G remote maintenance.
Industrial Buses: Integrates 2x CAN buses, 2x RS232, and 2x RS485, capable of directly connecting to servo motors, LiDAR, and PLCs.
Isolation Protection: Built-in 4x electrically isolated GPI and 4x electrically isolated GPO (3.3V/5V adjustable), plus 3x isolated UARTs, ensuring signal stability in harsh industrial sites with strong electromagnetic interference.
Q3: How does this device perform in terms of reliability and environmental adaptability in harsh industrial sites (e.g., cold storage, outdoors, or mobile chassis)?
A: The CF-28F2E4 features a rigorous industrial-grade design with strong environmental adaptability:
Wide Temperature: The standard edition supports -25°C to +65°C; selecting the AGX Orin Industrial module supports extreme environments of -40°C to +65°C.
Wide Voltage: Supports DC 9V~36V wide voltage input, adapting to power fluctuations of various mobile robots and industrial equipment.
Shock & ESD Protection: Equipped with comprehensive ESD (Electrostatic Discharge) protection and a compact, rugged chassis (202x195x65.5mm), making it highly suitable for deployment on AGV/AMR mobile chassis.
Q4: The CF-28F2E4 offers multiple Jetson AGX Orin module configurations. How should B2B customers choose the right one based on their application scenarios?
A: We provide three core configurations to meet different budgets and computing needs:
AGX Orin 64GB (275 TOPS): Ideal for high-end robotics handling multiple HD video streams, running large-parameter vision models, or complex multi-sensor fusion.
AGX Orin 32GB (200 TOPS): An ideal choice for industrial vision or automation control scenarios with moderate computing needs and a pursuit of high cost-effectiveness.
AGX Orin Industrial (248 TOPS, 64GB with ECC): Specifically designed for outdoor, in-vehicle, or mission-critical robotics requiring extreme temperatures and high data integrity (ECC memory error correction).
Q5: What OEM/ODM deep customization services can Changfan Tech provide for the CF-28F2E4?
A: Changfan Tech offers comprehensive customization from proof-of-concept to mass production:
Hardware Modifications: Adjust chassis dimensions, add/remove specific I/O interfaces, or customize special thermal solutions (like fanless passive cooling) based on chassis or cabinet space.
Software & Algorithm Pre-installation: Supports factory pre-installation of customized Ubuntu OS, JetPack SDKs, Docker containers, or even pre-flashing clients' proprietary vision recognition or navigation algorithm models.
Branding & Appearance: Supports silk-screen printing of customer brand logos and exclusive color customization, helping clients quickly launch to market.
Q6: As a B2B customer, does purchasing the CF-28F2E4 include comprehensive technical documentation and SDK testing support?
A: Yes. Changfan Tech provides all B2B customers with a complete technical support package, including detailed interface definitions, dimension drawings, and Recovery mode operation guides. Additionally, we provide rich SDK testing sample programs (covering test codes for CAN, RS232, RS485, GPIO, etc.), facilitating your R&D team's quick onboarding. For bulk purchases and OEM projects, we also provide dedicated one-on-one FAE (Field Application Engineer) technical support.


